Atrybut produktu |
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Part Number |
XCZU19EG-2FFVC1760E |
XCZU19EG-2FFVB1517I |
XCZU19EG-1FFVC1760E |
XCZU19EG-L1FFVC1760I |
Producent |
AMD |
AMD |
AMD |
AMD |
Pakiet |
Tray |
Tray |
Tray |
Tray |
Łączność |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Podstawowy numer produktu |
XCZU19 |
XCZU19 |
XCZU19 |
XCZU19 |
Seria |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Architektura |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
Package / Case |
1760-BBGA, FCBGA |
1517-BBGA, FCBGA |
1760-BBGA, FCBGA |
1760-BBGA, FCBGA |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Dostawca urządzeń Pakiet |
1760-FCBGA (42.5x42.5) |
1517-FCBGA (40x40) |
1760-FCBGA (42.5x42.5) |
1760-FCBGA (42.5x42.5) |
Prędkość |
533MHz, 600MHz, 1.3GHz |
533MHz, 600MHz, 1.3GHz |
500MHz, 600MHz, 1.2GHz |
500MHz, 600MHz, 1.2GHz |
Podstawowe atrybuty |
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Flash Rozmiar |
- |
- |
- |
- |
Wielkość pamięci RAM |
256KB |
256KB |
256KB |
256KB |
Liczba I / O |
512 |
644 |
512 |
512 |
temperatura robocza |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
Peryferia |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |