Atrybut produktu |
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Part Number |
XCZU2EG-L1SBVA484I |
XCZU3CG-1SFVC784E |
XCZU2EG-3SFVC784E |
XCZU2EG-1SBVA484E |
Producent |
AMD |
AMD |
AMD |
AMD |
Dostawca urządzeń Pakiet |
484-FCBGA (19x19) |
784-FCBGA (23x23) |
784-FCBGA (23x23) |
484-FCBGA (19x19) |
Wielkość pamięci RAM |
256KB |
256KB |
256KB |
256KB |
Flash Rozmiar |
- |
- |
- |
- |
Podstawowe atrybuty |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Seria |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC CG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Prędkość |
500MHz, 600MHz, 1.2GHz |
500MHz, 1.2GHz |
600MHz, 667MHz, 1.5GHz |
500MHz, 600MHz, 1.2GHz |
Pakiet |
Tray |
Tray |
Tray |
Tray |
Łączność |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Package / Case |
484-BFBGA, FCBGA |
784-BFBGA, FCBGA |
784-BFBGA, FCBGA |
484-BFBGA, FCBGA |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peryferia |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |
Liczba I / O |
82 |
252 |
252 |
82 |
temperatura robocza |
-40°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
Architektura |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
Podstawowy numer produktu |
XCZU2 |
XCZU3 |
- |
XCZU2 |