Atrybut produktu |
|
|
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Part Number |
XCZU4EV-1SFVC784I |
XCZU4EV-2FBVB900E |
XCZU4EV-2FBVB900I |
XCZU4EG-L1SFVC784I |
Producent |
AMD |
AMD |
AMD |
AMD |
temperatura robocza |
-40°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
Prędkość |
500MHz, 600MHz, 1.2GHz |
533MHz, 600MHz, 1.3GHz |
533MHz, 600MHz, 1.3GHz |
500MHz, 600MHz, 1.2GHz |
Peryferia |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |
Podstawowe atrybuty |
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Seria |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EG |
Flash Rozmiar |
- |
- |
- |
- |
Pakiet |
Tray |
Tray |
Tray |
Tray |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Łączność |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Dostawca urządzeń Pakiet |
784-FCBGA (23x23) |
900-FCBGA (31x31) |
900-FCBGA (31x31) |
784-FCBGA (23x23) |
Wielkość pamięci RAM |
256KB |
256KB |
256KB |
256KB |
Package / Case |
784-BFBGA, FCBGA |
900-BBGA, FCBGA |
900-BBGA, FCBGA |
784-BFBGA, FCBGA |
Podstawowy numer produktu |
XCZU4 |
XCZU4 |
XCZU4 |
XCZU4 |
Architektura |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
Liczba I / O |
252 |
204 |
204 |
252 |