Atrybut produktu |
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|
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Part Number |
XCZU7EV-1FBVB900E |
XCZU7EV-1FBVB900I |
XCZU7EV-2FBVB900I |
XCZU7EV-2FFVC1156I |
Producent |
AMD |
AMD |
AMD |
AMD |
Package / Case |
900-BBGA, FCBGA |
900-BBGA, FCBGA |
900-BBGA, FCBGA |
1156-BBGA, FCBGA |
Flash Rozmiar |
- |
- |
- |
- |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Łączność |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
temperatura robocza |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
Wielkość pamięci RAM |
256KB |
256KB |
256KB |
256KB |
Architektura |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
Liczba I / O |
204 |
204 |
204 |
360 |
Seria |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EV |
Peryferia |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |
Podstawowe atrybuty |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Podstawowy numer produktu |
XCZU7 |
XCZU7 |
XCZU7 |
XCZU7 |
Prędkość |
500MHz, 600MHz, 1.2GHz |
500MHz, 600MHz, 1.2GHz |
533MHz, 600MHz, 1.3GHz |
533MHz, 600MHz, 1.3GHz |
Dostawca urządzeń Pakiet |
900-FCBGA (31x31) |
900-FCBGA (31x31) |
900-FCBGA (31x31) |
1156-FCBGA (35x35) |
Pakiet |
Tray |
Tray |
Tray |
Tray |