Atrybut produktu |
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Part Number |
XCZU15EG-L1FFVB1156I |
XCZU17EG-1FFVB1517E |
XCZU19EG-2FFVC1760E |
XCZU19EG-1FFVC1760I |
Producent |
AMD |
AMD |
AMD |
AMD |
Pakiet |
Tray |
Tray |
Tray |
Tray |
Liczba I / O |
328 |
644 |
512 |
512 |
Podstawowe atrybuty |
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Dostawca urządzeń Pakiet |
1156-FCBGA (35x35) |
1517-FCBGA (40x40) |
1760-FCBGA (42.5x42.5) |
1760-FCBGA (42.5x42.5) |
Flash Rozmiar |
- |
- |
- |
- |
Architektura |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Seria |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Podstawowy numer produktu |
XCZU15 |
XCZU17 |
XCZU19 |
XCZU19 |
Prędkość |
500MHz, 600MHz, 1.2GHz |
500MHz, 600MHz, 1.2GHz |
533MHz, 600MHz, 1.3GHz |
500MHz, 600MHz, 1.2GHz |
Peryferia |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |
Łączność |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Wielkość pamięci RAM |
256KB |
256KB |
256KB |
256KB |
Package / Case |
1156-BBGA, FCBGA |
1517-BBGA, FCBGA |
1760-BBGA, FCBGA |
1760-BBGA, FCBGA |
temperatura robocza |
-40°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |