Atrybut produktu |
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|
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Part Number |
XCZU3EG-1SFVC784E |
XCZU3CG-2SFVC784E |
XCZU3EG-2SFVA625E |
XCZU3EG-1SFVC784I |
Producent |
AMD |
AMD |
AMD |
AMD |
Podstawowe atrybuty |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Flash Rozmiar |
- |
- |
- |
- |
Package / Case |
784-BFBGA, FCBGA |
784-BFBGA, FCBGA |
625-BFBGA, FCBGA |
784-BFBGA, FCBGA |
temperatura robocza |
0°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
Prędkość |
500MHz, 600MHz, 1.2GHz |
533MHz, 1.3GHz |
533MHz, 600MHz, 1.3GHz |
500MHz, 600MHz, 1.2GHz |
Seria |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC CG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Wielkość pamięci RAM |
256KB |
256KB |
256KB |
256KB |
Liczba I / O |
252 |
252 |
180 |
252 |
Łączność |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Podstawowy numer produktu |
XCZU3 |
XCZU3 |
XCZU3 |
XCZU3 |
Pakiet |
Tray |
Bulk |
Tray |
Tray |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peryferia |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |
Architektura |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
Dostawca urządzeń Pakiet |
784-FCBGA (23x23) |
784-FCBGA (23x23) |
625-FCBGA (21x21) |
784-FCBGA (23x23) |